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Micron MT36HTF51272FY-80EG1D6 4GB DDR2-800MHz FB-DIMM 2Rx4 CL6 Memory
- 4GB memory capacity
- DDR2 SDRAM technology
- Speed: 800MHz (PC2-6400)
- Type: FB-DIMM (Fully Buffered DIMM)
- Configuration: 2 ranks x 4 bits (2Rx4)
- CAS Latency: CL6
- Includes heat spreader for thermal management
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Product Overview
The Micron MT36HTF51272FY-80EG1D6 is a 4GB DDR2 Fully Buffered DIMM (FB-DIMM) memory module. It operates at 800MHz with a 2-rank x 4-bit configuration (2Rx4) and CL6 latency, designed for servers and high-end workstations that utilize FB-DIMM technology.
Technical Information
| Capacity | 4GB |
| Memory Type | DDR2 SDRAM |
| Form Factor | FB-DIMM (Fully Buffered DIMM) |
| Speed | 800MHz (PC2-6400) |
Additional Specifications
| Rank | 2Rx4 |
| CAS Latency | CL6 |
| Brand | Micron |
| Part Number | MT36HTF51272FY-80EG1D6 |
Product Description
The Micron MT36HTF51272FY-80EG1D6 is a 4GB memory module built on DDR2 technology, specifically designed for server and high-performance workstation environments that employ the Fully Buffered DIMM (FB-DIMM) architecture. This module operates at a clock speed of 800MHz, corresponding to the PC2-6400 standard, providing a significant bandwidth for demanding enterprise applications. The FB-DIMM technology, characterized by an Advanced Memory Buffer (AMB) chip on each module, was developed to overcome the scalability limitations of traditional buffered memory by serializing data transfers, allowing for higher memory capacities and densities. The module's configuration is specified as 2Rx4, indicating it has two ranks, with each rank composed of four memory chips. This configuration is optimized for the FB-DIMM architecture, which serializes data from the ranks before sending it to the memory controller. The CAS Latency (CL) is CL6, which represents the number of clock cycles between the memory controller issuing a read command and the data becoming available. A CL6 rating at 800MHz is typical for DDR2 FB-DIMMs and contributes to the module's overall performance. Each MT36HTF51272FY-80EG1D6 module features an integrated heat spreader, essential for managing the thermal output generated by the AMB chip and the DRAM components. FB-DIMMs tend to run hotter than standard DIMMs, making effective thermal dissipation critical for stability and longevity. This Micron module is a key component for systems requiring high memory capacity and reliability, often found in older server generations or specialized workstations that relied on the FB-DIMM standard for their memory subsystem.



