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Micron MT18KDF51272PDZ-1G6K1HF 4GB DDR3-1600MHz VLP RDIMM 2Rx8 Memory
- 4GB DDR3 SDRAM capacity
- 1600MHz memory speed
- CL11 latency
- 2Rx8 module organization
- Very Low Profile (VLP) Registered DIMM (RDIMM)
- ECC (Error-Correcting Code) support
- 1.5V voltage
- Designed for dense server configurations
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Product Overview
The Micron MT18KDF51272PDZ-1G6K1HF is a 4GB DDR3 Very Low Profile Registered DIMM (VLP RDIMM) memory module. It operates at 1600MHz with a CL11 latency and a 2Rx8 configuration, designed for space-constrained server environments.
Technical Information
| Memory Type | DDR3 SDRAM |
| Form Factor | VLP RDIMM |
| Capacity | 4GB |
| Speed | 1600MHz |
| CAS Latency | CL11 |
Additional Specifications
| Rank | 2Rx8 |
| Voltage | 1.5V |
| ECC | Yes |
| Profile | Very Low Profile |
Product Description
This 4GB DDR3 VLP RDIMM from Micron, model MT18KDF51272PDZ-1G6K1HF, is engineered for high-density server applications where space is a critical constraint. Its Very Low Profile (VLP) design allows for installation in compact server chassis and blade systems that cannot accommodate standard height DIMMs. The module operates at a speed of 1600MHz with a CAS latency of CL11, providing efficient memory performance for enterprise workloads. The 2Rx8 rank configuration indicates a dual-rank module, which can enhance performance by allowing the memory controller to access different banks of memory chips concurrently. As a Registered DIMM (RDIMM), it features an onboard register to buffer command and address signals, reducing the load on the memory controller and enabling greater memory capacity per channel. This is crucial for servers requiring substantial amounts of RAM. Furthermore, the inclusion of ECC (Error-Correcting Code) ensures data integrity by detecting and correcting single-bit errors, a fundamental requirement for reliable server operation. The module operates at a standard DDR3 voltage of 1.5V. The Micron MT18KDF51272PDZ-1G6K1HF is an ideal choice for upgrading or populating memory in specialized server environments that demand high capacity, reliability, and a compact form factor.
