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Micron MT18HTF25672FDY-667G1N8 2GB DDR2-667MHz FB-DIMM 2Rx8 CL5 Memory
- Capacity: 2GB
- Type: DDR2 SDRAM
- Speed: 667MHz (PC2-5300)
- Form Factor: FB-DIMM (Fully Buffered DIMM)
- Rank: 2R (Dual Rank)
- Latency: CL5
- Features an Advanced Memory Buffer (AMB).
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Product Overview
The Micron MT18HTF25672FDY-667G1N8 is a 2GB DDR2 Fully Buffered DIMM (FB-DIMM) memory module. It operates at 667MHz (PC2-5300) with CL5 latency, designed for servers and workstations requiring high-density memory configurations.
Technical Information
| Memory Capacity | 2GB |
| Memory Type | DDR2 SDRAM |
| Memory Speed | 667MHz |
| Module Type | FB-DIMM |
| Pin Count | 240-Pin |
Additional Specifications
| Rank | 2R (Dual Rank) |
| CAS Latency | CL5 |
| Voltage | 1.8V (standard for DDR2 FB-DIMM) |
| Features | Advanced Memory Buffer (AMB) |
Product Description
This 2GB DDR2 FB-DIMM memory module from Micron, model MT18HTF25672FDY-667G1N8, is designed for server and workstation environments that utilize the Fully Buffered DIMM architecture. FB-DIMMs incorporate an Advanced Memory Buffer (AMB) chip, which serializes data transfers between the memory module and the memory controller. This design allows for higher memory capacities and improved signal integrity compared to traditional unbuffered or registered DIMMs. The module operates at a speed of 667MHz, providing a bandwidth of PC2-5300. It is a Dual Rank (2R) module, meaning it has memory chips organized on both sides of the PCB, enabling the memory controller to access data more efficiently. The CL5 CAS Latency indicates the timing characteristics of the memory operations. FB-DIMMs were commonly used in servers from the mid-2000s to early 2010s, particularly in systems that required significant memory expansion. While they offered advantages in density, they also generated more heat and consumed more power than earlier memory types. This specific module is a reliable component for maintaining or upgrading systems that are compatible with DDR2 FB-DIMM technology. The 'N8' suffix may indicate a specific revision or packaging, but the core technical specifications remain consistent with the base model.
