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HP A3T35AV 64GB Kit (4x16GB) DDR3-1600MHz RDIMM 2Rx4 CL11 Memory
- 64GB total capacity (4x16GB modules)
- DDR3 SDRAM technology
- 1600MHz memory speed
- RDIMM (Registered DIMM) for enhanced stability and capacity
- 2Rx4 configuration (Dual Rank, 4 bits wide per chip)
- CL11 latency timing
- Optimized for HP server and workstation platforms
- 1.5V voltage operation
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Product Overview
The HP A3T35AV is a 64GB memory kit comprising four 16GB DDR3 RDIMM modules. Designed for HP ProLiant servers and workstations, this kit operates at 1600MHz with a CL11 latency. RDIMMs (Registered DIMMs) include a register chip that reduces the electrical load on the memory controller, enabling higher speeds and greater memory capacities.
Technical Information
| Capacity | 64GB Kit (4x16GB) |
| Memory Type | DDR3 SDRAM |
| Speed | 1600MHz |
| Form Factor | RDIMM |
Additional Specifications
| Rank | 2Rx4 |
| CAS Latency | CL11 |
| Voltage | 1.5V |
Product Description
The HP A3T35AV is a high-performance memory upgrade kit designed to significantly boost the memory capacity and performance of compatible HP server and workstation systems. This kit provides a total of 64GB of memory, distributed across four individual 16GB DDR3 modules. The DDR3 technology represents a generation of memory that offers improved bandwidth and lower power consumption compared to its predecessors, DDR2. Operating at a speed of 1600MHz, these modules facilitate rapid data transfer between the memory and the CPU, which is crucial for demanding enterprise workloads. Each module in the A3T35AV kit is an RDIMM (Registered DIMM). RDIMMs incorporate a register chip located between the DRAM chips and the system's memory controller. This register buffers the address and command signals, reducing the electrical load on the memory controller. Consequently, RDIMMs allow for higher memory module densities and greater overall system memory capacity, making them the standard choice for servers and high-end workstations where large amounts of RAM are required for virtualization, large datasets, and complex simulations. The 2Rx4 configuration signifies that each module is dual-rank, with each rank composed of DRAM chips that are 4 bits wide. This configuration can impact memory performance and how the system's memory controller addresses the memory. With a CAS Latency (CL) of 11, these modules offer a balance between speed and stability. The A3T35AV kit is specifically validated and optimized for HP platforms, ensuring seamless integration and reliable operation.
