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Supermicro MBD-X11SDC-8C Socket FCBGA2518 COM-HPC Motherboard
- COM-HPC Client Type 4 Module
- Supports Intel Xeon D-2100 series processors
- FCBGA2518 socket
- Up to 256GB DDR4 ECC RDIMM memory
- Multiple high-speed networking options (10GbE, 25GbE)
- Rich I/O including PCIe 4.0, USB 3.2, SATA
- Designed for rugged and embedded environments
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Key specifications
See full specs ↓- CPU Socket
- FCBGA2518
- Processor Family
- Intel Xeon D-2100
- Memory Type
- DDR4 ECC RDIMM
- Max Memory
- 256GB
- Form Factor
- COM-HPC
- Networking
- Multiple 10GbE/25GbE options
Product details
The Supermicro MBD-X11SDC-8C is a COM-HPC Motherboard designed for high-performance embedded computing. It features an FCBGA2518 socket and supports Intel Xeon D-2100 series processors, offering a powerful and compact solution for demanding industrial and edge computing applications.
Technical Information
| CPU Socket | FCBGA2518 |
| Processor Family | Intel Xeon D-2100 |
| Memory Type | DDR4 ECC RDIMM |
| Max Memory | 256GB |
Additional Specifications
| Form Factor | COM-HPC |
| Networking | Multiple 10GbE/25GbE options |
| PCIe | PCIe 4.0 support |
| Storage | SATA, NVMe |
Description
The Supermicro MBD-X11SDC-8C represents a significant advancement in embedded computing, utilizing the COM-HPC standard to deliver exceptional performance and flexibility. This motherboard is built around the FCBGA2518 socket, specifically designed to house Intel's powerful Xeon D-2100 series processors. These processors offer a high core count and robust performance, making the MBD-X11SDC-8C ideal for compute-intensive tasks at the edge, in industrial automation, or in demanding network infrastructure applications. Memory capacity and speed are critical for high-performance embedded systems, and this board excels in that regard. It supports up to 256GB of DDR4 ECC Registered DIMM (RDIMM) memory, providing ample bandwidth and error correction capabilities for mission-critical operations. The COM-HPC form factor allows for a compact yet feature-rich design, integrating essential I/O and expansion capabilities directly onto the module, which then connects to a carrier board for full system functionality. Connectivity and expansion are key strengths of the MBD-X11SCW-F. It offers a variety of high-speed networking options, including multiple 10GbE and potentially 25GbE ports, crucial for data-intensive edge applications. Furthermore, it provides extensive I/O support, including the latest PCIe 4.0 lanes for high-bandwidth peripherals, USB 3.2 ports for versatile device connection, and support for both SATA and NVMe storage solutions. This combination of processing power, memory capacity, and advanced I/O makes the MBD-X11SDC-8C a leading solution for next-generation embedded systems.
Condition: Refurbished
Free U.S. ground shipping
Typically 1–2 days handling, 3–7 days in transit.
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Government, enterprise, data center and small business.
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