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Samsung M392B5673GB0-YMA 2GB DDR3-1866MHz VLP RDIMM 2Rx8 CL13 Memory
- Capacity: 2GB
- Type: DDR3 SDRAM
- Speed: 1866MHz (PC3-14900)
- Form Factor: VLP RDIMM (Very Low Profile Registered DIMM)
- Rank: 2Rx8 (Dual Rank x8)
- Latency: CL13
- Voltage: Typically 1.5V
- Designed for dense servers
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Product Overview
This Samsung M392B5673GB0-YMA is a 2GB DDR3-1866MHz VLP RDIMM memory module. It features a 2Rx8 configuration and CL13 latency, designed for dense server environments where space is a constraint.
Technical Information
| Memory Size | 2GB |
| Memory Type | DDR3 SDRAM |
| Memory Speed | 1866MHz |
| Form Factor | VLP RDIMM |
Additional Specifications
| Rank | 2Rx8 |
| CAS Latency | CL13 |
| Voltage | 1.5V |
Product Description
The Samsung M392B5673GB0-YMA is a 2GB DDR3 Very Low Profile Registered DIMM (VLP RDIMM) module, engineered for high-density server applications where space is at a premium. The 'VLP' designation signifies its reduced height compared to standard RDIMMs, allowing for more modules to be installed in densely packed server chassis, such as 1U or 2U rack servers, without clearance issues. This module operates at a higher frequency of 1866MHz (PC3-14900), offering increased bandwidth and faster data transfer rates compared to lower-speed DDR3 modules. The Registered DIMM (RDIMM) architecture includes a register chip that buffers command and address signals, reducing the load on the memory controller and enabling greater system memory capacity and stability. The 2Rx8 configuration indicates a dual-rank design, which can further enhance performance by allowing the memory controller to access different ranks of memory independently. With a CAS Latency of CL13, this module provides relatively quick access times for DDR3 memory at this speed. The combination of VLP form factor, high speed, registered architecture, and dual-rank design makes the M392B5673GB0-YMA a robust solution for demanding server environments that require maximum memory capacity and performance within limited physical space. It is ideal for virtualization, cloud computing, and large-scale data processing applications.



