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Micron MTA18ADF4G72PZ-2G9B1 32GB DDR4-2933MHz VLP RDIMM 1Rx4 Memory
- 32GB DDR4 capacity
- 2933MHz memory speed
- VLP RDIMM (Very Low Profile Registered DIMM) form factor
- 1 rank per module (1Rx4)
- Optimized for dense server configurations
- Enhanced thermal performance due to VLP design
- Suitable for high-density blade servers and compact systems
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Product Overview
The Micron MTA18ADF4G72PZ-2G9B1 is a 32GB DDR4 memory module featuring a Very Low Profile (VLP) RDIMM design. It operates at 2933MHz with a 1Rx4 configuration, optimized for dense server environments where space and airflow are critical.
Technical Information
| Memory Type | DDR4 SDRAM |
| Capacity | 32GB |
| Speed | 2933MHz |
| Form Factor | VLP RDIMM |
Additional Specifications
| Rank | 1Rx4 |
| Latency | CL19 |
| Voltage | 1.2V |
Product Description
This Micron memory module, SKU MTA18ADF4G72PZ-2G9B1, is a 32GB DDR4 component designed with a Very Low Profile (VLP) form factor. The VLP design is crucial for high-density server applications, such as blade servers or compact rackmount systems, where vertical space is limited and efficient airflow is paramount. This reduced height allows for more modules to be installed in a given chassis while maintaining adequate cooling. The module operates at a speed of 2933MHz, providing excellent performance for a wide range of server workloads. Its 1Rx4 configuration signifies a single rank with four data channels per chip, offering a balance of capacity and efficiency for typical server tasks. The RDIMM (Registered DIMM) architecture includes an onboard register to buffer memory commands and addresses, reducing electrical load on the memory controller and improving system stability, especially with higher memory capacities. Micron's commitment to quality ensures that the MTA18ADF4G72PZ-2G9B1 meets the rigorous demands of enterprise environments. Its combination of VLP design, DDR4 technology, and reliable performance makes it an ideal choice for building scalable and efficient server infrastructure where space and thermal management are key considerations.
