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IBM 00AE745 System Board for BladeCenter Hs23 Supports E5-2600
- Type: System Board
- Compatibility: IBM BladeCenter HS23
- Processor Support: Intel Xeon E5-2600 series
- Enables blade server functionality
- Central hub for blade components
- Designed for high-density computing environments
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Product Overview
The IBM 00AE745 is a system board designed for the IBM BladeCenter HS23 server. It is engineered to support Intel Xeon E5-2600 series processors, providing a powerful computing foundation for blade server environments. This motherboard is the central component that enables the HS23 blade to function within the BladeCenter chassis.
Technical Information
| Product Type | System Board |
| Brand | IBM |
| Part Number | 00AE745 |
Additional Specifications
| Compatibility | IBM BladeCenter HS23 |
| Processor Support | Intel Xeon E5-2600 series |
Product Description
The IBM 00AE745 system board is the heart of the IBM BladeCenter HS23 compute blade. It is meticulously designed to accommodate the powerful Intel Xeon E5-2600 series processors, enabling high-performance computing within the dense BladeCenter ecosystem. This motherboard integrates all the essential components required for a blade server, including CPU sockets, memory slots, I/O connectors, and management interfaces, all within the compact form factor of a blade. This system board is crucial for the HS23 blade's ability to connect to the BladeCenter chassis's midplane. Through the midplane, it gains access to shared resources such as power, cooling, networking, and storage. The 00AE745 board is engineered to maximize the capabilities of the E5-2600 processors, supporting features like multiple cores, large cache sizes, and advanced instruction sets, making it suitable for demanding workloads like virtualization, high-performance computing (HPC), and enterprise applications. As a key component for the BladeCenter HS23, the 00AE745 ensures that the blade can deliver robust performance and reliability. It provides the necessary interfaces for memory expansion, allowing for significant RAM configurations to support memory-intensive applications. The board's design also facilitates efficient power delivery and thermal management, critical factors in the high-density environment of a blade chassis. This system board is essential for maintaining the operational integrity and computing power of the HS23 blade.
