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Hynix HMCG84AEBQA110N 32GB DDR5-4800MHz RDIMM 2Rx4 CL40 Memory
- 32GB DDR5 SDRAM Memory
- Speed: 4800MHz
- Form Factor: RDIMM (Registered DIMM)
- Rank: 2Rx4 (Dual Rank x4)
- CAS Latency: CL40
- Voltage: 1.1V
- ECC: Yes (Error-Correcting Code)
- Next-generation server memory
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Product Overview
This Hynix 32GB DDR5-4800MHz RDIMM memory module represents the next generation of server memory technology. It offers increased bandwidth, improved power efficiency, and higher densities compared to DDR4, with a dual-rank x4 configuration and CL40 latency.
Technical Information
| Memory Capacity | 32GB |
| Memory Type | DDR5 SDRAM |
| Memory Speed | 4800MHz |
| Form Factor | RDIMM |
Additional Specifications
| Rank | 2Rx4 |
| CAS Latency | CL40 |
| ECC | Yes |
| Voltage | 1.1V |
Product Description
The Hynix HMCG84AEBQA110N is a cutting-edge 32GB DDR5 Registered DIMM (RDIMM) module, designed to power the latest generation of high-performance servers and data centers. DDR5 technology introduces significant advancements over DDR4, including doubled burst lengths, on-die ECC for improved reliability, and independent 32-bit subchannels per module, which enhance efficiency and performance. This module operates at a rapid 4800MHz speed, providing substantially higher bandwidth crucial for data-intensive workloads. The 2Rx4 configuration signifies a dual-rank design, with each rank comprising four data bits per chip. This architecture, combined with DDR5's improved signaling, allows for greater memory density and performance scaling. The CL40 CAS Latency, while appearing higher than DDR4, is relative to the increased clock speeds and architectural changes in DDR5, and it contributes to the overall efficient operation of the module within the DDR5 ecosystem. As a Registered DIMM, the HMCG84AEBQA110N includes an onboard register to buffer command and address signals, reducing the electrical load on the memory controller and enabling higher memory capacities and system stability. The integrated on-die ECC enhances signal integrity at the chip level, complementing the system-level ECC for robust data protection. This module is ideal for environments demanding maximum performance, efficiency, and reliability, such as AI/ML, HPC, and large-scale cloud computing.
