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HP WX613AV 24GB Kit (6x4GB) DDR3-1333MHz UDIMM 2Rx8 CL9 Memory
- 24GB Total Capacity (6x 4GB modules)
- DDR3 SDRAM technology
- 1333MHz memory speed
- UDIMM (Unbuffered DIMM) form factor
- 2Rx8 rank organization per module
- CL9 latency timing
- ECC (Error-Correcting Code) support
- Designed for HP Z Workstations
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Product Overview
This HP memory kit provides a total of 24GB across six 4GB UDIMM modules, operating at DDR3-1333MHz speed. It features a 2Rx8 rank and CL9 latency, designed for HP workstations requiring reliable performance.
Technical Information
| Memory Type | DDR3 SDRAM |
| Total Capacity | 24GB |
| Module Size | 4GB |
| Number of Modules | 6 |
| Speed | 1333MHz |
Additional Specifications
| Form Factor | UDIMM |
| Rank | 2Rx8 |
| Latency | CL9 |
| ECC | Yes |
Product Description
The HP WX613AV is a memory upgrade kit specifically designed for HP Z Workstations, offering a total of 24GB of memory distributed across six 4GB Unbuffered DIMM (UDIMM) modules. This kit leverages DDR3 technology, operating at a speed of 1333MHz, which was a standard for performance in its era. The UDIMM form factor is common in workstations and desktops, providing a balance of performance and cost-effectiveness. Each module in the kit is configured as 2Rx8, indicating dual ranks with eight bits per DRAM chip, which can enhance performance in compatible systems. The memory operates with a CL9 latency, representing the number of clock cycles required for the memory to respond to a request. This relatively low latency, combined with the 1333MHz speed, ensures efficient data access for demanding workstation applications. The kit is also equipped with ECC (Error-Correcting Code) capabilities. ECC memory is crucial for professional workstations as it can detect and correct memory errors, thereby enhancing data integrity and system stability, which is vital for tasks like complex modeling, rendering, and scientific computations where accuracy is paramount. This specific kit is tailored for compatibility with various HP Z Workstation models, ensuring seamless integration and optimal performance. By providing a substantial 24GB capacity, it allows users to run more applications simultaneously, handle larger datasets, and improve the overall responsiveness of their workstation. The inclusion of multiple modules facilitates memory configurations that can take advantage of dual-channel or triple-channel memory architectures supported by the workstation's motherboard.
