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Gigabyte MB10-DS4 Socket FCBGA1667 Mini-ITX Motherboard

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Gigabyte MB10-DS4 Socket FCBGA1667 Mini-ITX Motherboard

SKU MB10-DS4
Brand Gigabyte
  • Intel BGA 1667
  • Server Mini-ITX
  • DDR4-SDRAM Maximum internal memory: 32 GB
  • SATA III
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Key specifications

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Processor manufacturer
Intel
Processor socket
BGA 1667
Intel Xeon series
D-1500
Processor number of cores supported
4
Processor codename
Broadwell
Supported memory types
DDR4-SDRAM

Product details

GIGABYTE MB10-DS4 (rev. 1.3). Processor manufacturer: Intel, Processor socket: BGA 1667, Intel Xeon series: D-1500. Supported memory types: DDR4-SDRAM, Maximum internal memory: 32 GB, Memory channels: Dual-channel. Supported storage drive interfaces: SATA III. On-board graphics card model: Aspeed AST2400. LAN controller: Intel I210

Processor

Processor manufacturerIntel
Processor socketBGA 1667
Intel Xeon seriesD-1500
Processor number of cores supported4
Processor codenameBroadwell

Memory

Supported memory typesDDR4-SDRAM
Memory channelsDual-channel
Memory voltage1.2 V
Supported memory clock speeds1600,1866,2133 MHz
Maximum internal memory32 GB

Storage controllers

Supported storage drive interfacesSATA III

Graphics

Discrete graphics supportYes
On-board graphics card modelAspeed AST2400

Internal I/O

Number of SATA III connectors6
ATX Power connector (24-pin)Yes
Power fan connectorNo
CPU fan connectorYes
Number of chassis fan connectors1
Number of COM connectors1

Rear panel I/O ports

USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity2
Ethernet LAN (RJ-45) ports3
VGA (D-Sub) ports quantity1
Microphone inNo

Network

Ethernet LANYes
LAN controllerIntel I210
Wi-FiNo

Features

Component forServer
Motherboard form factorMini-ITX

Expansion slots

PCI Express x16 (Gen 3.x) slots1

Operational conditions

Operating temperature (T-T)10 - 35 °C
Operating relative humidity (H-H)8 - 80%

Packaging data

Package width233 mm
Package depth214 mm
Package height62 mm

Weight & dimensions

Width170 mm
Depth170 mm

Packaging content

Cables includedSATA

Other features

Supported UDIMM module capacity16GB
Supported RDIMM module capacity32GB
Quick installation guideYes
Number of DIMM slots4
Number of processors supported1
Thermal Design Power (TDP)45 W

Description

Designed for high density and scale-out server infrastructures, these processors focus on high power efficiency while maintaining datacenter grade features, such as large storage and memory platforms. Through this density and computing power, they aim at lowering the TCO of enterprise & public clouds, storage, and network applications.

Condition: Refurbished

Free U.S. ground shipping

Typically 12 days handling, 37 days in transit.

Purchase orders accepted

Government, enterprise, data center and small business.

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