Gigabyte MB10-DS4 Socket FCBGA1667 Mini-ITX Motherboard
Shop all Gigabyte parts (763) ›- Intel BGA 1667
- Server Mini-ITX
- SATA III
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Key specifications
See full specs ↓- Processor manufacturer
- Intel
- Processor socket
- BGA 1667
- Intel Xeon series
- D-1500
- Processor number of cores supported
- 4
- Processor codename
- Broadwell
- Supported memory types
- DDR4-SDRAM
Documents
Product details
GIGABYTE MB10-DS4 (rev. 1.3). Processor manufacturer: Intel, Processor socket: BGA 1667, Intel Xeon series: D-1500. Supported memory types: DDR4-SDRAM, Maximum internal memory: 32 GB, Memory channels: Dual-channel. Supported storage drive interfaces: SATA III. On-board graphics card model: Aspeed AST2400. LAN controller: Intel I210
Specifications
- Processor manufacturer
- Intel
- Processor socket
- BGA 1667
- Intel Xeon series
- D-1500
- Processor number of cores supported
- 4
- Processor codename
- Broadwell
- Supported memory types
- DDR4-SDRAM
- Memory channels
- Dual-channel
- Memory voltage
- 1.2 V
- Supported memory clock speeds
- 1600,1866,2133 MHz
- Maximum internal memory
- 32 GB
- Supported storage drive interfaces
- SATA III
- Discrete graphics support
- Yes
- On-board graphics card model
- Aspeed AST2400
- Number of SATA III connectors
- 6
- ATX Power connector (24-pin)
- Yes
- Power fan connector
- No
- CPU fan connector
- Yes
- Number of chassis fan connectors
- 1
- Number of COM connectors
- 1
- USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity
- 2
- Ethernet LAN (RJ-45) ports
- 3
- VGA (D-Sub) ports quantity
- 1
- Microphone in
- No
- Ethernet LAN
- Yes
- LAN controller
- Intel I210
- Wi-Fi
- No
- Component for
- Server
- Motherboard form factor
- Mini-ITX
- PCI Express x16 (Gen 3.x) slots
- 1
- Operating temperature (T-T)
- 10 - 35 °C
- Operating relative humidity (H-H)
- 8 - 80%
- Package width
- 233 mm
- Package depth
- 214 mm
- Package height
- 62 mm
- Width
- 170 mm
- Depth
- 170 mm
- Cables included
- SATA
- Supported UDIMM module capacity
- 16GB
- Supported RDIMM module capacity
- 32GB
- Quick installation guide
- Yes
- Number of DIMM slots
- 4
- Number of processors supported
- 1
- Thermal Design Power (TDP)
- 45 W
Description
Designed for high density and scale-out server infrastructures, these processors focus on high power efficiency while maintaining datacenter grade features, such as large storage and memory platforms. Through this density and computing power, they aim at lowering the TCO of enterprise & public clouds, storage, and network applications.
Condition: Refurbished
Free U.S. ground shipping
Typically 1–2 days handling, 3–7 days in transit.
Purchase orders accepted
Government, enterprise, data center and small business.
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