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Foundry 10G-XNPK-ZRD-1560-61 10Gbs Xenpak 80km Dup SC SMF Transceiver
- Data Rate: 10Gb/s
- Form Factor: XENPAK
- Interface: Single-Mode Fiber (SMF)
- Connector Type: Duplex SC
- Maximum Distance: 80 km
- Designed for long-haul networking
- Supports Extended Reach (ER) applications
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Product Overview
The Foundry 10G-XNPK-ZRD-1560-61 is a 10Gb/s XENPAK transceiver module designed for extended-reach single-mode fiber applications. It supports distances up to 80 kilometers and uses a duplex SC connector.
Technical Information
| Product Type | Transceiver Module |
| Data Rate | 10 Gb/s |
| Form Factor | XENPAK |
| Fiber Type | Single-Mode Fiber (SMF) |
Additional Specifications
| Connector | Duplex SC |
| Max Distance | 80km |
| Wavelength | Typically 1550nm for ER |
| Application | Long Haul, WAN |
Product Description
The Foundry 10G-XNPK-ZRD-1560-61 is a high-performance 10 Gigabit Ethernet transceiver module utilizing the XENPAK form factor. It is engineered for demanding long-haul and wide-area network (WAN) applications where extended transmission distances are critical. Operating at 10Gb/s, this transceiver provides the high bandwidth necessary for backbone network infrastructure, data center interconnects, and other mission-critical communication links. This module is specifically designed for use with single-mode fiber (SMF) optic cables, enabling data transmission over significantly greater distances than multi-mode fiber. With a maximum reach of 80 kilometers, it is ideal for connecting geographically dispersed locations, such as between cities or across large metropolitan areas. The duplex SC connector provides a robust and reliable physical interface for the fiber optic connections. The 10G-XNPK-ZRD-1560-61 typically operates at a wavelength suitable for extended reach (often around 1550nm) and may include features like Digital Diagnostic Monitoring (DDM) for real-time performance monitoring. The XENPAK form factor, while larger than newer standards like SFP+, was common for early 10Gb/s deployments and is known for its robustness and thermal management capabilities, making it suitable for high-density networking equipment.
