622187-L21 HP 2.93GHz 2.5GT/s DMI 8MB SmartCache Socket LGA1156 Intel Xeon X3470 4-Core Processor
Shop all HP parts (82,894) ›- Intel® Xeon® 3000 Sequence X3470 2.93 GHz
- 8 MB L3 LGA 1156 (Socket H)
- Maximum internal memory supported by processor: 32 GB DDR3-SDRAM
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Key specifications
See full specs ↓- Processor model
- X3470
- Processor base frequency
- 2.93 GHz
- Processor family
- Intel® Xeon® 3000 Sequence
- Processor cores
- 4
- Processor socket
- LGA 1156 (Socket H)
- Component for
- Server/workstation
Documents
Product details
HP Intel Xeon X3470. Processor family: Intel® Xeon® 3000 Sequence, Processor socket: LGA 1156 (Socket H), Processor lithography: 45 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 32 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, PCI Express configurations: 1x16, 2x8, 4x4, Number of Processing Die Transistors: 774 M. Intel® Virtualization Technology (Intel® VT): VT-d, VT-x, Compatibility: ML110 G6
Specifications
- Processor model
- X3470
- Processor base frequency
- 2.93 GHz
- Processor family
- Intel® Xeon® 3000 Sequence
- Processor cores
- 4
- Processor socket
- LGA 1156 (Socket H)
- Component for
- Server/workstation
- Processor lithography
- 45 nm
- Processor threads
- 8
- System bus rate
- 2.5 GT/s
- Processor operating modes
- 64-bit
- Processor boost frequency
- 3.6 GHz
- Processor cache
- 8 MB
- Processor cache type
- L3
- Thermal Design Power (TDP)
- 95 W
- VID Voltage Range
- 0.6500 - 1.4000 V
- Bus type
- QPI
- Memory bandwidth supported by processor (max)
- 21 GB/s
- Maximum internal memory supported by processor
- 32 GB
- Memory types supported by processor
- DDR3-SDRAM
- Memory clock speeds supported by processor
- 800,1066,1333 MHz
- Memory channels
- Dual-channel
- ECC
- Yes
- On-board graphics card
- No
- Execute Disable Bit
- Yes
- Idle States
- Yes
- Thermal Monitoring Technologies
- No
- Market segment
- Server
- Maximum number of PCI Express lanes
- 1
- PCI Express slots version
- 2.0
- PCI Express configurations
- 1x16, 2x8, 4x4
- Number of Processing Die Transistors
- 774 M
- Processing Die size
- 296 mm²
- Supported instruction sets
- SSE4.2
- CPU configuration (max)
- 1
- Embedded options available
- No
- Intel® Hyper Threading Technology (Intel® HT Technology)
- Yes
- Intel® Turbo Boost Technology
- Yes
- Intel® AES New Instructions (Intel® AES-NI)
- No
- Enhanced Intel SpeedStep Technology
- Yes
- Intel Trusted Execution Technology
- Yes
- Intel VT-x with Extended Page Tables (EPT)
- Yes
- Intel Demand Based Switching
- Yes
- Intel Virtualization Technology (VT-x)
- Yes
- Intel Virtualization Technology for Directed I/O (VT-d)
- Yes
- Intel® vPro™ Platform Eligibility
- No
- Tcase
- 72.7 °C
- Intel® Virtualization Technology (Intel® VT)
- VT-d, VT-x
- Compatibility
- ML110 G6
Description
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Condition: Refurbished
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