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Siemens P10-04B557500 30PIN SIMM 60NS HY85117800BSJ-60 GOLD LEAF WITH PARITY
- Type: SIMM Memory Module
- Capacity: Not specified (typical for older SIMMs, often 1MB, 4MB, 16MB, 32MB)
- Pin Count: 30-pin
- Speed: 60ns access time
- Features: Gold Leaf Contacts, Parity Support
- Manufacturer: Siemens
- Part Number: P10-04B557500
- Component Identifier: HY85117800BSJ-60
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Product Overview
The Siemens P10-04B557500 is a 30-pin SIMM memory module with a 60ns access time. It features gold leaf contacts and parity support, designed for specific older computer systems requiring this type of RAM.
Technical Information
| Form Factor | SIMM |
| Pin Count | 30-pin |
| Access Time | 60ns |
| Features | Gold Leaf, Parity |
Additional Specifications
| Brand | Siemens |
| Part Number | P10-04B557500 |
| Component ID | HY85117800BSJ-60 |
Product Description
The Siemens P10-04B557500 is a legacy memory module designed for older computer architectures that utilize 30-pin SIMM (Single In-line Memory Module) technology. This specific module is characterized by its 60 nanosecond (ns) access time, indicating the speed at which data can be retrieved from the memory. The inclusion of gold leaf contacts is a feature often found in higher-quality or older components, intended to provide superior conductivity and corrosion resistance for reliable connections. This SIMM also supports parity checking, a basic error detection mechanism. Parity memory adds an extra bit to each byte of data, allowing the system to detect if a single bit has been corrupted during storage or transmission. While not as robust as ECC (Error-Correcting Code) memory, parity provides a level of data integrity that was important in many systems of the era. Given its specifications, the P10-04B557500 is intended for specific vintage computer systems, servers, or industrial equipment that were designed to accommodate 30-pin SIMMs with parity. Its compatibility is limited to motherboards and chipsets that explicitly support this form factor and speed. The HY85117800BSJ-60 designation likely refers to a specific manufacturing batch or revision by the underlying memory chip producer.
