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IBM 7038-4454 8GB Kit (4x2GB) DDR-266MHz Micro-DIMM 2Rx8 CL2.5 Memory
- Total Capacity: 8 GB Kit
- Module Capacity: 4 x 2 GB
- Memory Type: DDR SDRAM
- Speed: 266 MHz (PC2100)
- Form Factor: Micro-DIMM
- Configuration: 2Rx8 (Dual Rank, x8)
- Latency: CL2.5
- Manufacturer: IBM
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Product Overview
This IBM memory kit includes four 2GB DDR-266MHz Micro-DIMM modules, totaling 8GB. It is designed for systems requiring high-speed, low-profile memory, specifically featuring a 2Rx8 organization and CL2.5 latency.
Technical Information
| Total Capacity | 8 GB |
| Module Size | 2 GB |
| Number of Modules | 4 |
| Memory Type | DDR SDRAM |
Additional Specifications
| Speed | 266 MHz |
| Form Factor | Micro-DIMM |
| Rank | 2Rx8 |
| CAS Latency | CL2.5 |
Product Description
The IBM 7038-4454 memory kit is engineered for high-performance computing environments that utilize the Micro-DIMM form factor, often found in compact or specialized systems like servers, workstations, or high-end laptops. The kit provides a total of 8GB of RAM, distributed across four 2GB modules, allowing for flexible memory configurations and potential for dual-channel operation depending on the host system's architecture. Operating at DDR-266MHz (also known as PC2100), this memory offers a substantial bandwidth for its generation, facilitating faster data transfer between the CPU and memory. The 2Rx8 organization indicates that each module is dual-ranked with eight memory chips per rank, which can influence performance characteristics in certain server applications. The CL2.5 CAS latency specifies the delay between the memory controller requesting data and the data becoming available, representing a moderate speed for DDR memory. This specific type of memory is crucial for applications demanding significant memory bandwidth and capacity, such as virtualization, large database operations, or complex scientific simulations. The Micro-DIMM form factor is essential for systems with limited physical space, where standard DIMMs or SO-DIMMs would not fit. Ensuring compatibility with the host system's motherboard and chipset is paramount when deploying this memory kit.
