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712987-B21 - HP Platinum C7000 Configure-to-Order Enclosure
- Enclosure Type: Blade System Chassis
- Form Factor: 10U Rackmount
- Blade Support: Accommodates up to 16 server blades
- Redundant Power Supplies: Supports multiple hot-plug power supplies
- Cooling: Integrated high-performance fans
- Management: Onboard Administrator module
- Connectivity: Multiple network interconnect modules
Free U.S. Ground Shipping
Typically 1-2 handling + 3-7 transit days
Purchase orders accepted
For government, enterprise, data center, and small business customers.
Bulk Purchase Inquiry
Volume pricing and availability
Product Overview
The HP Platinum C7000 Configure-to-Order (CTO) Enclosure is a high-density server blade system chassis. It provides a shared infrastructure for multiple HP ProLiant server blades, offering power, cooling, and network connectivity.
Technical Information
| Product Type | Blade System Enclosure |
| Form Factor | 10U Rackmount |
| Max Server Blades | 16 |
Additional Specifications
| Management | Onboard Administrator |
| Power Redundancy | Supported |
Product Description
The HP Platinum C7000 Configure-to-Order (CTO) Enclosure is a sophisticated chassis designed to house and manage multiple HP ProLiant server blades. This 10U rackmount enclosure provides a consolidated platform for compute, storage, and networking resources, significantly reducing the physical footprint and simplifying management in enterprise data centers. It is engineered to support up to 16 server blades, allowing organizations to deploy a high density of computing power within a single unit. The C7000 enclosure features redundant, hot-pluggable power supplies and high-performance cooling fans to ensure continuous operation and reliability. This design minimizes downtime and allows for maintenance without interrupting service. Management of the C7000 enclosure and its installed blades is handled through an integrated Onboard Administrator module, providing centralized control over hardware status, configuration, and performance monitoring. The enclosure also supports various network interconnect modules, enabling flexible and high-speed connectivity options tailored to specific business requirements.

