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Micron MT36HTS51272FZ-667A2E3 4GB DDR2-667MHz FB-DIMM 2Rx4 CL5 Memory

Micron MT36HTS51272FZ-667A2E3 4GB DDR2-667MHz FB-DIMM 2Rx4 CL5 Memory

SKU:MT36HTS51272FZ-667A2E3
  • Capacity: 4GB
  • Type: DDR2 FB-DIMM
  • Speed: 667MHz (PC2-5300F)
  • Latency: CL5
  • Configuration: 2Rx4 (Dual Rank, x4 Data Width)
  • Designed for servers and high-performance workstations
  • Utilizes an Advanced Memory Buffer (AMB)
  • Supports high memory bandwidth requirements
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Details

Product Overview

The Micron MT36HTS51272FZ-667A2E3 is a 4GB DDR2 Fully Buffered DIMM (FB-DIMM) memory module. It operates at 667MHz with CL5 latency, designed for servers and workstations requiring high memory bandwidth and capacity.

Technical Information

Product TypeMemory Module
Capacity4 GB
Memory TypeDDR2 SDRAM
Form FactorFB-DIMM

Additional Specifications

Speed667 MHz
CAS LatencyCL5
Rank2Rx4

Product Description

The Micron MT36HTS51272FZ-667A2E3 is a 4GB DDR2 Fully Buffered DIMM (FB-DIMM) memory module, specifically engineered for server and high-end workstation environments. FB-DIMMs differ from standard DIMMs by incorporating an Advanced Memory Buffer (AMB) chip on the module itself. This AMB chip serializes data transfers between the memory controller and the DRAM chips, effectively reducing pin count on the motherboard and increasing memory bandwidth, especially in systems with many memory modules. This particular module operates at a speed of 667MHz, corresponding to a PC2-5300F data transfer rate. It features a CAS Latency (CL) of 5, indicating the number of clock cycles required to access data. The 2Rx4 configuration signifies that it is a dual-rank module, with each rank utilizing x4 data width DRAM chips. Dual-rank modules can offer performance benefits in certain memory architectures by allowing the memory controller to interleave accesses between ranks. FB-DIMMs were a transitional technology, primarily used in servers during the DDR2 era, to overcome the limitations of parallel bus architectures. While they offered higher bandwidth potential, they also generated more heat due to the AMB chip and had higher latency compared to some contemporary technologies. This Micron module is a key component for systems that leverage the FB-DIMM architecture for demanding memory-intensive tasks.

Condition:Refurbished

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