#upgradetobetter

Home/Memory/Server Memory/HP GZ475AV 2GB Kit (2x1GB) DDR2-667MHz FB-DIMM 2Rx...
HP GZ475AV 2GB Kit (2x1GB) DDR2-667MHz FB-DIMM 2Rx8 CL5 Memory

HP GZ475AV 2GB Kit (2x1GB) DDR2-667MHz FB-DIMM 2Rx8 CL5 Memory

SKU:GZ475AV
  • Total Capacity: 2GB (2 x 1GB modules)
  • Memory Type: DDR2 SDRAM
  • Speed: 667MHz (PC2-5300)
  • Form Factor: FB-DIMM (Fully Buffered DIMM)
  • Configuration: 2Rx8 (Dual Rank, x8 data width)
  • CAS Latency: CL5
  • Designed for servers and high-end workstations
  • Features an integrated heat spreader/heat sink
Get a Quick Price Quote

Click on Inquire to get latest price

Free U.S. Ground Shipping

Typically 1-2 handling + 3-7 transit days

Purchase orders accepted

For government, enterprise, data center, and small business customers.

Bulk Purchase Inquiry

Volume pricing and availability

Details

Product Overview

This HP GZ475AV is a 2GB memory kit containing two 1GB DDR2-667MHz FB-DIMM modules. It is designed for servers and workstations requiring reliable memory performance at a 667MHz speed.

Technical Information

Capacity2GB Kit (2 x 1GB)
Memory TypeDDR2 SDRAM
Speed667MHz
Module TypeFB-DIMM

Additional Specifications

Rank2Rx8
CAS LatencyCL5
BrandHP
Part NumberGZ475AV

Product Description

The HP GZ475AV memory kit provides a total of 2GB of DDR2 RAM, supplied as two 1GB Fully Buffered DIMM (FB-DIMM) modules. These modules operate at a frequency of 667MHz, identified as PC2-5300, and are engineered for server and workstation applications where stability and compatibility are key. The FB-DIMM design incorporates an Advanced Memory Buffer (AMB) chip on each module, which isolates the memory controller from the DRAM chips, thereby improving signal integrity and enabling higher memory capacities and speeds. This kit features a 2Rx8 configuration, indicating that each 1GB module is dual-ranked and uses x8 (8-bit wide) DRAM chips. Dual-ranking allows the memory controller to access different ranks of memory independently, potentially enhancing performance through improved utilization of the memory bus. The x8 DRAM chip width is a common configuration for DDR2 modules. With a CAS Latency (CL) of 5, these modules offer relatively fast response times for DDR2 memory. FB-DIMMs are known to generate significant heat due to the AMB chip, so they are equipped with integrated heat spreaders or heat sinks to manage thermal output and ensure reliable operation within server environments. This HP-branded memory kit is a suitable choice for upgrading or populating memory in compatible server systems.

Condition:Refurbished

Related Products

Loading Related Inventory...