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HP GY652AV 4GB Kit (2x2GB) DDR2-800MHz FB-DIMM 2Rx4 CL6 Memory
- Total Capacity: 4GB (2 x 2GB modules)
- Memory Type: DDR2 SDRAM
- Speed: 800MHz (PC2-6400)
- Form Factor: FB-DIMM (Fully Buffered DIMM)
- Configuration: 2Rx4 (Dual Rank, x4 data width)
- CAS Latency: CL6
- Designed for servers and high-end workstations
- Features an integrated heat spreader/heat sink
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Product Overview
This HP GY652AV is a 4GB memory kit comprising two 2GB DDR2-800MHz FB-DIMM modules, configured as 2Rx4. It is designed for servers and workstations requiring high-speed, high-density memory.
Technical Information
| Capacity | 4GB Kit (2 x 2GB) |
| Memory Type | DDR2 SDRAM |
| Speed | 800MHz |
| Module Type | FB-DIMM |
Additional Specifications
| Rank | 2Rx4 |
| CAS Latency | CL6 |
| Brand | HP |
| Part Number | GY652AV |
Product Description
The HP GY652AV memory kit delivers a total of 4GB of DDR2 RAM, provided as two 2GB Fully Buffered DIMM (FB-DIMM) modules. These modules operate at a frequency of 800MHz, corresponding to PC2-6400 specifications, and are intended for server and workstation platforms that require substantial memory bandwidth and capacity. The FB-DIMM architecture incorporates an Advanced Memory Buffer (AMB) chip, which enhances signal integrity and allows for higher memory configurations compared to traditional unbuffered DIMMs. This specific kit is configured as 2Rx4, meaning each 2GB module is dual-ranked and utilizes x4 (4-bit wide) DRAM chips. The x4 configuration can sometimes offer advantages in specific memory controller designs or when interleaving across ranks and banks is heavily utilized, potentially leading to improved performance in certain workloads. The dual-rank design further allows the memory controller to access different ranks independently, potentially increasing throughput. With a CAS Latency (CL) of 6, these modules have slightly higher latency timings compared to CL5 modules but maintain the high 800MHz operational speed. FB-DIMMs are known for generating more heat due to the AMB chip, hence they are equipped with integrated heat spreaders or heat sinks to ensure thermal stability and reliability under demanding server operating conditions. This HP-branded memory is built to meet the rigorous demands of enterprise environments.
