Safe Checkout
Secure Payments
Fast Delivery
Order Today
Free Shipping
Across the US
Easy Returns
Hassle-Free
HP GW354AV 4GB Kit (2x2GB) DDR2-800MHz FB-DIMM 2Rx8 CL5 Memory
- Total Capacity: 4GB (2 x 2GB modules)
- Memory Type: DDR2 SDRAM
- Speed: 800MHz (PC2-6400)
- Form Factor: FB-DIMM (Fully Buffered DIMM)
- Configuration: 2Rx8 (Dual Rank, x8 data width)
- CAS Latency: CL5
- Designed for servers and high-end workstations
- Features an integrated heat spreader/heat sink
Click on Inquire to get latest price
Free U.S. Ground Shipping
Typically 1-2 handling + 3-7 transit days
Purchase orders accepted
For government, enterprise, data center, and small business customers.
Bulk Purchase Inquiry
Volume pricing and availability
Product Overview
This HP GW354AV is a 4GB memory kit consisting of two 2GB DDR2-800MHz FB-DIMM modules. It is designed for servers and workstations requiring high-speed, high-density memory configurations.
Technical Information
| Capacity | 4GB Kit (2 x 2GB) |
| Memory Type | DDR2 SDRAM |
| Speed | 800MHz |
| Module Type | FB-DIMM |
Additional Specifications
| Rank | 2Rx8 |
| CAS Latency | CL5 |
| Brand | HP |
| Part Number | GW354AV |
Product Description
The HP GW354AV memory kit provides a total of 4GB of high-performance RAM, distributed across two 2GB Fully Buffered DIMM (FB-DIMM) modules. This configuration is specifically tailored for server and workstation environments that demand robust memory capabilities to handle demanding applications and large datasets. The DDR2 technology, operating at a speed of 800MHz (often referred to as PC2-6400), ensures rapid data transfer between the memory and the processor. FB-DIMMs are characterized by an Advanced Memory Buffer (AMB) chip integrated onto the module itself. This buffer manages data flow, reducing electrical loading on the memory controller and allowing for higher memory densities and speeds than traditional unbuffered DIMMs. The 2Rx8 designation indicates that each 2GB module is dual-ranked, with each rank utilizing x8 (8-bit wide) DRAM chips. This architecture can improve performance by allowing the memory controller to access different ranks concurrently. With a CAS Latency (CL) of 5, these modules offer a balance between speed and timing. The integrated heat spreader or heat sink on FB-DIMMs is crucial for dissipating the heat generated by the AMB chip, ensuring stable operation under heavy loads. This HP-branded kit is designed to meet the stringent reliability and performance standards required for enterprise-grade computing platforms.
