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HP 416043-001 Power Supply Blank filler For BladeSystem C7000/C3000
- Occupies an empty power supply slot in BladeSystem enclosures.
- Ensures proper airflow and thermal management.
- Prevents dust and debris ingress into the chassis.
- Designed specifically for HP BladeSystem C7000 and C3000.
- Maintains the structural integrity of the enclosure.
- Facilitates optimal cooling of active components.
Free U.S. Ground Shipping
Typically 1-2 handling + 3-7 transit days
Purchase orders accepted
For government, enterprise, data center, and small business customers.
Bulk Purchase Inquiry
Volume pricing and availability
Product Overview
The HP 416043-001 is a Power Supply Blank Filler designed for HP BladeSystem C7000 and C3000 enclosures. It occupies an empty power supply bay, ensuring proper airflow and thermal management within the chassis.
Technical Information
| Product Type | Power Supply Blank Filler |
| Compatibility | HP BladeSystem C7000/C3000 |
Additional Specifications
| Function | Airflow management |
Product Description
The HP 416043-001 Power Supply Blank Filler is a crucial component for maintaining the optimal operating environment within HP BladeSystem C7000 and C3000 enclosures. While not an active electronic device, its role in thermal management and chassis integrity is significant. When a power supply bay is not populated with a functional power supply unit, this blank filler occupies the space, ensuring that the enclosure's internal airflow is directed correctly across the active components. Proper airflow is essential for preventing overheating and ensuring the longevity and performance of the servers and other modules housed within the BladeSystem. By sealing off unused power supply bays, the blank filler prevents air from bypassing the intended cooling paths, thereby maintaining efficient heat dissipation. This is particularly important in high-density blade server environments where heat generation can be substantial. Beyond its thermal management function, the blank filler also serves to protect the internal components of the BladeSystem from environmental contaminants such as dust and debris. It contributes to the overall structural integrity of the enclosure by filling an empty slot, ensuring that the chassis remains robust. This seemingly simple component plays a vital role in the reliable operation of HP's blade server infrastructure.
