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Dell TYFN1-1 FX2S 4 Node 2U Hsp I Enclosure
- Dell PowerEdge FX2/FX2s Node Enclosure
- 2U form factor
- High-Speed Interconnect (HSP I) module
- Accommodates up to 4 server nodes
- Provides high-speed internal connectivity
- Designed for dense, modular computing
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Product Overview
The Dell TYFN1-1 is a 2U High-Speed Interconnect (HSP I) Enclosure for the Dell PowerEdge FX2/FX2s platform. It is designed to house up to four server nodes and provides high-speed connectivity between them and the chassis's internal networking components.
Technical Information
| Product Type | Node Enclosure / Interconnect Module |
| Platform Compatibility | Dell PowerEdge FX2/FX2s |
| Form Factor | 2U |
Additional Specifications
| Node Capacity | Up to 4 |
| Key Feature | High-Speed Interconnect (HSP I) |
Product Description
The Dell TYFN1-1 is a crucial component of the Dell PowerEdge FX2 and FX2s converged infrastructure platform. This 2U enclosure serves as the central housing for multiple server nodes, enabling a highly dense and modular computing environment. The 'HSP I' designation indicates its role as a High-Speed Interconnect module, responsible for facilitating rapid communication between the installed server nodes and the chassis's networking fabric. By integrating up to four server nodes within a single 2U chassis, the TYFN1-1 allows organizations to consolidate compute resources efficiently. This design simplifies management, reduces the physical footprint, and lowers power and cooling requirements compared to deploying individual rack servers. The high-speed interconnect ensures that data can flow seamlessly between nodes and to external networks, supporting demanding workloads such as virtualization, high-performance computing, and large-scale data processing. This enclosure is designed for flexibility, allowing administrators to mix and match different types of server nodes (sold separately) to create a tailored compute solution. The TYFN1-1, as the interconnect module, is fundamental to the FX2/FX2s architecture, enabling the platform's ability to deliver scalable performance and efficient resource utilization within a compact and manageable form factor.

