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654804-B21 - HP 2.4GHz 3200MHz HTL 2 x 8MB L3 Cache Socket G34 AMD Opteron 6234 12-Core Processor Kit
- AMD Opteron 6234 2.4 GHz
- 16 MB L3 Socket G34
- Processor cores: 12 32 nm 64-bit 115 W
- Tray
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Key specifications
See full specs ↓- Processor model
- 6234
- Processor base frequency
- 2.4 GHz
- Processor family
- AMD Opteron
- Processor cores
- 12
- Processor socket
- Socket G34
- Component for
- Server/workstation
Documents
Product details
HP AMD Opteron 6234. Processor family: AMD Opteron, Processor socket: Socket G34, Processor lithography: 32 nm. Memory clock speeds supported by processor: 2000 MHz. Market segment: Server
Processor
| Processor model | 6234 |
| Processor base frequency | 2.4 GHz |
| Processor family | AMD Opteron |
| Processor cores | 12 |
| Processor socket | Socket G34 |
| Component for | Server/workstation |
| Processor lithography | 32 nm |
| Processor operating modes | 64-bit |
| Processor cache | 16 MB |
| Processor cache type | L3 |
| Thermal Design Power (TDP) | 115 W |
| Package type | Tray |
| Stepping | B2 |
Memory
| Memory clock speeds supported by processor | 2000 MHz |
Graphics
| On-board graphics card | No |
Features
| Market segment | Server |
Processor special features
| AMD Virtualization Technology | Yes |
Operational conditions
| Maximum operating temperature | 70.4 °C |
Description
AMD proudly presents the AMD Opteron™ 6200 Series—the world’s first and only 16-core x86 server processor with the highest core density for incredible scalability to handle demanding multi-threaded workloads such as cloud computing, virtualization, high-performance computing (HPC), databases and business applications. The innovative modular architecture helps pack in more cores, making it the natural choice for heavy-threaded cloud computing environments and enterprise applications that demand outstanding performance and scalability. Performance AMD has designed several new features, including AMD Turbo CORE technology and Flex FP, into its processors so that datacenters can maximize their performance potential. AMD-P New additions to the AMD-P suite of energy-efficient technologies like TDP Power Cap and the C6 power state helps customers maximize the performance per watt in their datacenter and can help lower power and cooling costs. Direct Connect Architecture 2.0 HyperTransport™ 3.0 Technology (HT3) enables outstanding interconnect speeds between cores, cache and quad-memory channels supporting up to 1600MHz DDR3 memory.
Condition: Refurbished
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